Honor’s Kirin 970 Chipset Is Ready To Burn The Market

Honor’s first mobile AI computing platform, Kirin 970, is in the horizon. Although it remains unknown that which model will feature this revolutionary chipset that is being touted as the “Big Daddy” of all chipsets. It is expected to turn the smartphone market upside down with its capabilities.

A new generation chipset, the Kirin 970 features ultra-fast connection, intelligent computing capability, HD audio-visual effects, and long battery life. Built through the most advanced TSMC 10 nm process technology, it integrates 5.5 billion transistors in an area that’s surprisingly as small as a fingernail. A combination of an octa-core CPU, a 12-core GPU, dual ISP, a 1.2 Gbps high-speed Cat.18 LTE modem, and an innovative HiAI mobile computing architecture, the Kirin 970 performs about 25 times faster than any other processor. It also empowers you with far better image recognition, voice interaction, and intelligent photography. In a nutshell it brings you everything you had wished for in your smartphone.

As if all this is not enough check this out - The 1.2 Gbps ultra-fast modem helps the mobile Internet set a new record in connection speed. Since the mobile Internet has become an important platform for people to communicate and socialize with each other, this will give the entire movement a big thrust forward. But the problem of fragmentation of the global frequency spectrum is still dogging global carriers, smartphone vendors, and chipset vendors. The Kirin 970 has made breakthroughs in the communication field and adopted advanced technologies to aggregate fragmented frequency spectrums into the maximum bandwidth. Allowing users to experience faster and clearer communication.

So just wait for the release of the next Honor smartphone model. It’ll enable a broader use of AI technology in the application field and provide you with a never-before-seen AI experience right in your palm.